Reliability & Failure of Electronic Materials & Devices

Rating:
Summary: A true textbook, rather than a handbook, on reliability
Review: I have a filing cabinet full of papers on various aspects of materials reliabilty: solder stress calculations, mechanical behavior, diffusion, corrosion mechanisms, etc. Professor Ohring's book neatly summarizes all of that into one coherent text, covering topics such as electromigration, electrostatic discharge, solder mechanics, corrosion, semiconductor devices and more. But rather than touch on the practical aspects of these failure modes, as do several reliability books I already own, he delves into the underlying fundamental mechanisms involved, providing equations and explanations. This is why I consider Ohring's book a true textbook on the subject. The detailed explanations are valuable to me in that they provide a springboard from which to analyze more complex issues. For anyone involved with reliability of materials in electronics, I highly recommend this book. And one more thing: in some places Prof. Ohring writes with a refreshing informality. For example, he talks about defects and KILLER DEFECTS (his words and capitalization!). I just laughed when I saw that.

Rating:
Summary: Highly Recommendable
Review: The book is an excellent summary on the topic and more! It provides excellent coverage of state-of-the-art production techniques and the influence of particular procedures and components on device reliability. I suppose that complete newcomers might find it sometimes difficult to understand the background of some contents due to the compact style. However they are rewarded with one of the most comprehensive and up-to-date texts I have ever seen on this subject. Moreover the reader is provided with many references for further in-depth reading. Considering the wealth of information the book provides the author did an excellent job in writing a well readable text.

I would recommend it as a textbook as well as for the experienced scientist/researcher.

Rating:
Summary: Highly Recommendable
Review: The book is an excellent summary on the topic and more! It provides excellent coverage of state-of-the-art production techniques and the influence of particular procedures and components on device reliability. I suppose that complete newcomers might find it sometimes difficult to understand the background of some contents due to the compact style. However they are rewarded with one of the most comprehensive and up-to-date texts I have ever seen on this subject. Moreover the reader is provided with many references for further in-depth reading. Considering the wealth of information the book provides the author did an excellent job in writing a well readable text.

I would recommend it as a textbook as well as for the experienced scientist/researcher.

Rating:
Summary: Excellent review on device reliability and failure analysis
Review: This book gives the basic and latest issues in the semiconductor device reliability as well as issues that nails the failure analysts. This book covers all the major issues, including oxide reliability, ESD and electromigration. This book will be and should be considered for the aspring Rel and FA engineers as well as act as a refresher to those hardcore professionals.