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Chemical-Mechanical Polishing of Low Dielectric Constant Polymers and Organosilicate Glasses: Fundamental Mechanisms and Application to Ic Interconnect Technology

Chemical-Mechanical Polishing of Low Dielectric Constant Polymers and Organosilicate Glasses: Fundamental Mechanisms and Application to Ic Interconnect Technology

List Price: $158.00
Your Price: $158.00
Product Info Reviews

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Rating: 3 stars
Summary: Good textbook on the subject
Review: This book gives a solid, easy to read introduction to CMP and all the different factors associated with it. The text is accessible to any undergraduate in engineering, yet contains a lot of information that makes it handy as a reference.


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